Danny Weber
21:54 31-01-2026
© E. Vartanyan
In 2026, flagship phones with Snapdragon 8 Elite Gen 6 and MediaTek Dimensity 9600 may launch alongside iPhone 18, challenging Apple's timing advantage.
The smartphone market could become even more competitive in 2026. New leaks suggest that flagship phones powered by the Snapdragon 8 Elite Gen 6 and MediaTek Dimensity 9600 will launch in the same month as the iPhone 18, potentially stripping Apple of its usual timing advantage. Traditionally, Apple has unveiled its iPhones a couple of weeks ahead of rivals, securing pre-orders and capturing consumer attention before Android alternatives arrive.
According to insiders, Qualcomm and MediaTek are planning to release their new top-tier chipsets in September—the traditional iPhone launch month. This means the three largest mobile processor makers could hit the market almost simultaneously for the first time. Last year's situation was different: Apple presented the iPhone 17 on September 9, while the Snapdragon 8 Elite Gen 5 and Dimensity 9500 only appeared closer to the end of the month, giving the iPhone a significant head start.
Adding further intrigue is the fact that all three companies are preparing their first 2nm processors. Apple is expected to use TSMC's N2 process, while Qualcomm and MediaTek might adopt the enhanced N2P variant. In theory, this could offer a slight performance boost and better distribution of manufacturing capacity.
However, experts point out that Apple retains a strong card: its supply chain. Even if Qualcomm and MediaTek chips are announced in the same month, Android flagships typically require more time to appear on store shelves worldwide in large numbers. In contrast, iPhones usually go on sale almost immediately after their presentation and quickly saturate key markets.
To fully eliminate Apple's advantage, Android chipmakers will need not only to ensure timely deliveries of 2nm SoCs but also to synchronize device launches with partners like Samsung, Xiaomi, and other brands. This will be especially challenging against the backdrop of the ongoing DRAM crisis and rising component costs overall.