Apple M5 Pro and M5 Max could use 2.5D packaging to reduce overheating

Future Apple M5 Pro and M5 Max processors may abandon the familiar InFO packaging in favor of TSMC's more advanced 2.5D technology. This move aims not only to boost performance but also to address a key issue with top-tier Apple Silicon chips: overheating under heavy loads.

According to preliminary data, updated 14- and 16-inch MacBook Pro models with M5 Pro and M5 Max chips are expected to launch in spring 2026, retaining the existing cooling system. This suggests Apple is focusing on changes at the chip packaging level rather than redesigning the chassis.

Unlike InFO, 2.5D technology allows computing blocks to be separated into multiple discrete components. This approach improves heat distribution, reduces electrical resistance, and minimizes the risk of localized hot spots. As a result, processors maintain more stable performance under sustained loads and hit thermal limits less frequently.

An additional benefit is improved chip yield. Manufacturing CPU and GPU modules separately enables individual testing, allowing defective elements to be replaced without scrapping the entire die. For Apple, this is particularly important given memory shortages and rising costs of advanced manufacturing processes.

In practice, modern Apple chips can consume over 200 watts in peak scenarios, with temperatures in some configurations approaching critical levels. Transitioning to 2.5D packaging combined with SoIC-MH could significantly reduce thermal load and extend stable operation during demanding tasks.

If Apple implements this approach in the M5 Pro and M5 Max, similar packaging will likely become standard for subsequent generations, including the M6. This also indirectly signals the company's preparation for more complex and hotter 2nm chips expected in the coming years.