Qualcomm could solve overheating in flagship smartphones using Samsung tech

Qualcomm could solve one of the most painful problems with flagship smartphones—overheating—using Samsung's technologies. According to insider information, the upcoming Snapdragon 8 Elite Gen 6 will feature a new heat dissipation system borrowed from Exynos.

This involves the Heat Pass Block, or HPB, technology. It's a special heat transfer block installed directly on top of the processor, functioning as a compact heat sink. Samsung developed it, and the company uses it in the Exynos 2600—a chip expected to appear in part of the Galaxy S26 lineup.

If the leak is confirmed, Qualcomm could significantly improve the thermal performance of its top-tier chips. This is especially relevant given recent Snapdragon-based flagships, which often overheat under load, quickly throttle frequencies, and lose performance. Manufacturers have already experimented with fans, but active cooling impacts battery life and complicates water resistance.

Interestingly, rumors about Samsung's willingness to license HPB to third-party companies emerged a couple of months ago. If Qualcomm does implement this technology, the Snapdragon 8 Elite Gen 6 could run noticeably cooler than its predecessors—marking the first time Exynos plays a key role in improving a competing platform.