Intel's potential MediaTek deal for 14A node in mobile chips

A new intrigue is brewing around Intel's advanced manufacturing processes. Online reports suggest the company may have secured MediaTek as a client for its upcoming 14A node. If confirmed, this could mean Dimensity-series mobile chips would be manufactured using this process, marking a significant step for Intel in the foundry market.

Until now, Apple was considered Intel's primary potential partner for advanced nodes. Earlier reports indicated Apple was evaluating the 18A-P process for lower-tier M-series chips and non-Pro iPhones, while also considering using Intel's proprietary EMIB packaging for its own ASICs by 2028. Apple has already signed NDAs and received PDK kits for testing, lending additional credibility to Intel's strategy.

However, a potential collaboration with MediaTek represents a much bolder scenario. Intel's 18A and 14A processes rely on Backside Power Delivery, which supplies power from the rear of the chip. In theory, this reduces voltage loss and frees up space for routing, but in practice, it offers limited performance gains and increases self-heating effects. This is particularly critical for mobile SoCs, where cooling is severely constrained.

This is why analysts are approaching the rumor with caution. If Intel can successfully adapt the 14A process for mobile chips and genuinely attract MediaTek, it could be a turning point for its foundry business and a signal to other potential clients. Until official confirmation arrives, however, this information should be viewed as an intriguing but unverified leak.