Danny Weber
13:01 27-08-2025
© D. Novikov
TSMC will ramp 2 nm chips this fall, with mass production in Q4 2025 and wafer prices near $30,000. See key customers, capacity plans, and N2 to A14 roadmap.
TSMC, the world’s largest contract semiconductor manufacturer, will begin ramping production of 2 nm processors this fall. According to Taiwan’s Economic Daily, mass production is slated for the fourth quarter of 2025, and the price of a single wafer could reach $30,000. The figure underscores how premium and constrained this first wave of capacity will be.
In the early stages, six tech heavyweights are set to be the main customers: Apple, AMD, Qualcomm, MediaTek, Broadcom, and Intel. Apple is expected to receive nearly half of the initial output, a distribution that should help stabilize the ramp. By 2027, additional clients including Amazon Annapurna, Google, Marvell, Bitmain, and more than ten other companies are due to join, setting up a fresh surge in demand for 2 nm technology.
TSMC is expanding its footprint to meet that appetite. By the end of 2025, its Baoshan and Kaohsiung facilities are planned to produce up to 50,000 2 nm wafers per month, rising to 100,000 wafers in 2026. Capacity in the United States is also expected to come online ahead of schedule, and by 2028 total monthly output should reach 200,000 wafers. The timetable points to a notably aggressive ramp for projects of this complexity.
On the technology roadmap, N2 is only the starting point. In 2026, TSMC plans to introduce the enhanced N2P and A16, followed by A14 in 2028. New fabs in Taiwan and the United States will support these nodes, a combination set to keep TSMC at the forefront of the semiconductor industry for several more years.