Apple exploring sub-1 nm chip production with TSMC for future iPhones

Apple could make another technological leap in the coming years. According to industry sources, the company is exploring with TSMC a move to chip production with a process node below 1 nm, with a trial launch of such solutions expected as early as 2029.

While the market is just preparing for the arrival of 2 nm processors, set to debut in new iPhone generations, TSMC is already working on the next stages of development. The company plans to launch mass production of 1.4 nm chips by 2028, which should deliver a noticeable boost in performance and energy efficiency.

The next step will involve mastering sub-nanometer technologies, considered extremely challenging from a manufacturing perspective. For the test run, TSMC intends to utilize several plants, including facilities in Taiwan, aiming for an initial volume of around 5,000 wafers per month.

Although potential customers for such chips have not been officially named, analysts are confident that Apple will be one of the first clients. The company traditionally gains access to the most advanced process nodes, even if it requires significant upfront costs at the start of production.

However, the path to mass production of these solutions remains difficult due to yield issues. These complexities are already impacting the market: smartphone manufacturers are increasingly forced to limit the use of top-tier processors to only the most expensive models.