Danny Weber
A blogger tests a new MEMS fan that cools processors directly at chip level. The ultra-thin, silent solution could revolutionize cooling in mobile and computing devices.
Blogger @DigitalChatStation has reported testing a new approach to processor cooling — an active MEMS fan that can operate directly at the chip level. The solution is being developed for collaboration with modern domestic technologies and is considered a potentially promising direction for the industry.
According to the description, the device is an ultra-thin active cooling system that fits tightly against the processor. Unlike traditional miniature fans, this solution is only a few millimeters thick, nearly silent, and provides more efficient heat dissipation.
MEMS (Micro-Electro-Mechanical Systems) combine mechanical and electronic components at the micrometer or millimeter scale. These technologies are already used in various sensors and micromechanical devices, including accelerometers, gyroscopes, and microphones.
It is separately noted that piezoelectric MEMS cooling solutions already exist in the industry. For example, at CES 2026, Infinix presented a bladeless cooling system with a vibrating plate about 0.1 mm thick, capable of creating high-pressure airflow.
Such solutions demonstrate high efficiency: they are claimed to outperform conventional fans by about 10 times in cooling, maintaining low temperatures under prolonged loads, including gaming and AI tasks.
The emergence of chip-level MEMS cooling could be the next step in the development of compact and energy-efficient heat dissipation systems for mobile and computing devices.
© A. Krivonosov