TSMC to build 1.4 nm A14 Fab 25 in Taichung, volume by 2028

While TSMC’s 2 nm chips are slated for mass production only at the end of 2025, the world’s largest contract chipmaker is already lining up its next leap. According to Economic News Daily, the company plans to get ahead of schedule and begin construction in October on its first facility for 1.4 nm chips, also referred to as A14 or Angstrom.

The site, called Fab 25, will rise in the Central Taiwan Science Park near Taichung. The campus is set to include four plants, with the first targeted to enter pilot production by the end of 2027. Full-scale volume output of 1.4 nm chips is slated for the second half of 2028. The new node is expected to deliver a 15% performance uplift while cutting power consumption by 30% compared to previous generations.

The investment is striking: TSMC is prepared to allocate up to NT$1.5 trillion (about $49 billion) to the project. For context, 2 nm production currently costs customers an average of $30,000 per wafer, whereas 1.4 nm chips could reach $45,000 per unit. Equipment suppliers have already been notified to accelerate deliveries for the upcoming facility.

Taken together, the plans signal TSMC’s intent not just to safeguard its lead in semiconductors but to lay the groundwork for an even bolder target: 1 nm processors. Although no timeline has been named for their pilot production, industry observers say the miniaturization race is speeding up, and the next few years will be decisive for the global chip market. The timing leaves little doubt that TSMC aims to stay a step ahead as demand for cutting-edge nodes takes shape.