TSMC readies 1.4 nm A14 node, skipping High-NA EUV

TSMC, the world’s largest chipmaker, is preparing for its next technological leap — the 1.4 nm (A14) node. According to Commercial Times, the company will start building a fab in Taichung by the end of 2025, with mass production not expected before the second half of 2028. The timeline underscores the scale of the effort and the caution that comes with pushing manufacturing limits.

Notably, TSMC does not plan to deploy ASML’s cutting-edge, high-priced High-NA EUV systems, each costing about $400 million. Instead, the Taiwanese giant intends to rely on sophisticated multi-patterning techniques to achieve the required precision on existing EUV tools. This path demands more time and tuning budgets, yet the company is confident it can meet the necessary targets. Skipping High-NA looks like a calculated bet to control costs without surrendering technical ground.

Development of the process itself will take place at the company’s Hsinchu site, while hiring for the Taichung facility is already under way. In August, TSMC secured permits to build three structures, with total investment estimated at $49 billion. A portion of that is earmarked for buying roughly 30 EUV scanners in 2027.

The move to A14 is expected to cut chip power consumption by up to 30% compared with current process technologies. Challenges are inevitable, but TSMC has both the runway and the equipment to refine the node and maintain its lead in semiconductors, staying ahead of rivals from the United States, China, and South Korea. If execution matches the plan, the company keeps its footing at the top of the industry’s steepest climb.