Danny Weber
02:15 07-11-2025
© A. Krivonosov
A leaked prototype points to a hefty vapor chamber for the Galaxy S27 Ultra, tested with early Exynos 2600 silicon and eyeing laptop-level thermal headroom.
A fresh leak from Korean sources points to a curious detail about Samsung’s next flagships: a photo of a prototype vapor chamber said to be in development for the Galaxy S27 Ultra. Judging by the image, the cooling solution looks hefty enough to pass for a laptop part rather than a phone component. Thick copper plates and heatsink fins sandwiched between them suggest serious thermal headroom—Samsung appears intent on pushing efficiency to a new tier.
Details shared on X by user SPYGO19726 describe the current unit as an experimental build. In a retail device, the chamber would be significantly downsized so it fits the phone’s chassis without adding thickness. The design is reportedly being trialed with early Exynos 2600 silicon, which has already posted benchmark numbers comparable to Apple’s M5.
If that holds, Samsung could seize the lead in mobile cooling—especially with Apple only recently bringing a vapor chamber to the iPhone 17 Pro and 17 Pro Max. The drive to raise a flagship’s thermal budget toward laptop territory reads as a logical escalation: today’s 2 nm chips demand as much attention to heat management as to raw performance.
Still, expectations should be tempered. The prototype may remain a lab exercise rather than a production part of the Galaxy S27 Ultra. Even so, the very act of testing such a system signals where Samsung is steering its cooling tech—and it seems competitors can already feel the heat.