MediaTek Dimensity 7100: 6 nm mid-range 5G with 8-core CPU, Mali-G610 GPU, LPDDR5, UFS 3.1, Wi-Fi 6, Bluetooth 5.4, improved power efficiency for longer use.
© MediaTek
MediaTek has quietly introduced the Dimensity 7100, a new processor that broadens its roster of mid-range smartphone chips. The part is already listed on the company’s official website and is built on TSMC’s 6 nm process, bringing 5G support and an emphasis on energy efficiency. The low-key rollout suggests a pragmatic update aimed at real-world gains rather than headline-grabbing specs.
At its core, the Dimensity 7100 uses an eight-core layout with four performance Cortex-A78 cores clocked up to 2.4 GHz and four power-saving Cortex-A55 cores at 2.0 GHz. The architecture will be familiar from earlier Dimensity 7000 solutions, but MediaTek says users should see faster app launches and smoother multitasking compared with previous generations.
Graphics are handled by an Arm Mali-G610 GPU, which, according to the company, delivers up to an 8% performance gain over the Dimensity 7050. The focus, however, is less on peak numbers and more on cutting power draw: MediaTek indicates roughly 5% lower consumption in everyday use, up to 16% during media playback, and up to 23% for the modem. For the mid-range segment, those efficiency gains tend to matter more than raw horsepower.
The built-in 5G modem supports the 3GPP Release 16 standard, with download speeds up to 3.3 Gbps, and uses UltraSave 3.0+ to reduce energy use during sustained 5G connections. The platform also supports LPDDR5 memory at up to 5,500 Mb/s, UFS 3.1 storage, Wi‑Fi 6, and Bluetooth 5.4.
Media features include 10-bit color, HDR video, and camera resolutions up to 200 MP, along with improved HDR, noise-reduction, and autofocus algorithms. Support for fast charging up to 45 W and the UFCS universal protocol is also listed, which is intended to deliver longer battery life on phones powered by the new chip. On paper, the package looks well balanced for mainstream devices.