Benchmark results for the Honor Magic 8 Pro Air show impressive performance with MediaTek Dimensity 9500 chipset, 16GB RAM, and flagship specs in a compact 6.1mm body.
© A. Krivonosov
Benchmark results for the compact Honor Magic 8 Pro Air have surfaced online ahead of its official launch, revealing impressive performance despite the device's small size.
According to Geekbench, model number LDY-AN00 is powered by the MediaTek Dimensity 9500 chipset running at full clock speed. The processor features an octa-core architecture: one core at 4.21 GHz, three high-performance cores at 3.50 GHz, and four efficiency cores at 2.70 GHz. Graphics are handled by the Mali-G1-Ultra-MC12. The tested unit ran Android 16 with MagicOS 10 and had 16 GB of RAM, ensuring smooth multitasking and high stability. In Geekbench, the smartphone scored 2,969 points in the single-core test and 9,892 points in the multi-core test, confirming the compact flagship's power.
Latest reports indicate the Magic 8 Pro Air will feature a 6.31-inch AMOLED display with 1.5K resolution, a 120 Hz refresh rate, and LTPO technology. The screen promises minimal bezels and high-frequency PWM for eye comfort. The main camera will include a 50 MP sensor, complemented by a 50 MP ultra-wide-angle camera and a 64 MP periscope telephoto lens with over 3x optical zoom. The front camera will also offer 50 MP resolution.
The smartphone will come with a 5,500 mAh battery, support for 80 W wired charging and 50 W wireless charging, an ultrasonic fingerprint scanner, dual speakers, eSIM, a dedicated AI control button, and IP68/IP69 water and dust resistance. Notably, the device will measure just 6.1 mm in thickness and weigh 155 grams, making it one of the thinnest Android flagships.
The Honor Magic 8 Pro Air is scheduled to launch in China on January 19 alongside the Magic 8 RSR, with a global release date yet to be announced.