Samsung's Exynos 2700 chipset, launching in Q4 2026 with 2nm GAA process, will power Galaxy S27. Learn about its impact on mobile SoC market and Samsung's semiconductor roadmap.
© D. Novikov
Samsung is preparing to launch its next-generation chipset, the Exynos 2700, which industry sources indicate will debut in the fourth quarter of 2026. This processor is being developed using the second-generation 2-nanometer GAA process, known as SF2P. The chip is expected to become a key component in the Galaxy S27 lineup, helping Samsung strengthen its position in the mobile SoC market.
Although the Exynos 2700 will be exclusive to the Galaxy S27 series, its impact will extend beyond this single product line. Samsung LSI, the division responsible for chip, sensor, and modem development, will supply the processor to the Mobile Experience unit. This move is set to boost internal revenue and drive growth in the company's non-memory business. Estimates suggest the Exynos 2700 could account for up to 50% of all chipset shipments in the Galaxy S27 series, reducing Samsung's reliance on Qualcomm solutions.
According to DigiTimes, mass production of the Exynos 2700 is slated to begin by late 2026. The chip's launch could generate around 163 billion won in operating profit, equivalent to roughly $113 million for this business segment. The basic design for the SF2P process was finalized last year, and Samsung is actively promoting the new technology as a significant advancement in 2-nanometer architecture.
However, questions remain about production yields. Reports indicate that the current yield rate for the first-generation 2-nanometer GAA process is around 50%, which appears modest as the company transitions to the next version. Despite this, Samsung is already planning to introduce SF2P+—the third-generation 2-nanometer GAA—in the coming years, showcasing an ambitious roadmap for its semiconductor technology development.