Discover Qualcomm's FastConnect 8800, the first mobile chip with Wi-Fi 8 and Bluetooth 7 support, offering 11.6 Gbps speeds for future flagship devices.
© D. Novikov
At MWC 2026, Qualcomm unveiled the FastConnect 8800, the first mobile connectivity system to support both Wi-Fi 8 and Bluetooth 7. This new chip marks a leap to the next generation of wireless technology, even as Wi-Fi 7 and Bluetooth 6 are just beginning to see widespread adoption in devices.
Built on a 6nm process, the FastConnect 8800 features an upgraded 4×4 radio configuration. Compared to the standard 2×2 setup, this delivers a significant boost in bandwidth. The maximum theoretical data transfer rate reaches 11.6 Gbps—nearly triple that of previous solutions in the lineup.
Support for Wi-Fi 8 brings new capabilities, including an extended range. In practice, this means more stable connections over longer distances and improved performance in challenging network conditions. Beyond Wi-Fi 8, the chip offers Bluetooth 7 with increased data transfer speeds of up to 7.5 Mbps. It also incorporates support for Snapdragon Sound, XPAN, and Bluetooth LE Audio technologies, enabling high-resolution audio transmission with minimal latency.
The FastConnect 8800 is expected to appear in future flagship Snapdragon mobile platforms, though there is no official confirmation yet of its integration into the next Snapdragon 8 Elite Gen 6. According to Qualcomm, the first consumer devices featuring the new chip will launch in late 2026.
Overall, the picture is straightforward: Qualcomm is making a serious bet on the future of wireless connectivity, offering smartphones a performance and speed buffer for years to come.