TSMC may build up to 12 fabs and packaging plants in Arizona, boosting U.S. semiconductor production with major investments and strategic expansion.
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TSMC could significantly expand its U.S. presence by building up to 12 fabs and several additional facilities in Arizona. According to sources, this represents a major investment phase that could form part of an agreement between Taiwan and the U.S. to inject hundreds of billions of dollars into the American tech sector.
The company is already developing a site near Phoenix, originally planned for six manufacturing modules. However, new rumors suggest this number could double. There is also talk of constructing four advanced chip packaging plants and a research center, which would create a complete development and production cycle within the U.S.
Interest in the project has been further piqued by TSMC's recent purchase of around 900 acres of land, bringing the total site size to approximately 2,000 acres. This indirectly supports expansion plans, though the company has not officially commented on such intentions. Experts note that implementing a project of this scale would require colossal investment—building advanced fabs could cost tens of billions of dollars each.
Despite active discussions, TSMC's final plans remain uncertain. For now, these are only rumors and preliminary estimates, but the very preparation for expansion underscores the strategic importance of the U.S. for the future of the semiconductor industry.