Samsung is reportedly exploring the possibility of adding liquid cooling to future Galaxy smartphones, according to Korean media. The company believes the technology could reduce heat buildup and improve performance stability, especially during gaming, AI tasks, and other heavy processor loads.
A dedicated team has been set up at Samsung’s manufacturing technology research institute to focus on active cooling, as reported by Sisa Journal-e. The team is developing both air and liquid heat dissipation solutions, which could eventually appear in commercial Galaxy devices.
Air cooling in phones typically relies on a small built-in fan to quickly lower temperatures, but it adds weight, noise, and complexity. Liquid cooling, on the other hand, could be quieter and more compact, though it’s harder to implement due to water resistance requirements and limited internal space.
Many current hybrid systems use a fan for initial cooling and a liquid loop for extra heat dissipation. Such setups have been seen in gaming phones from Chinese brands and devices with active mini-fans. However, senior researcher Park Min indicated that Samsung wants to pursue a fanless liquid system to avoid noise and other drawbacks.
Samsung’s interest in new cooling methods makes sense. Modern phones increasingly handle intensive local AI tasks, demanding games, and powerful chips that require stable thermal management. The issue is particularly sensitive for Samsung after the Galaxy S22 controversy, where a game optimization service throttled performance to control heat.
If the development reaches production models, liquid cooling could become a key differentiator for future Galaxy devices. According to Park Min, high heat directly impacts processor and power component performance and raises the risk of electronic failures. He also noted that Apple is already patenting active cooling technologies, suggesting commercial adoption of such systems in smartphones may not be far off.