Thermal Grizzly, known among cooling and overclocking enthusiasts, brought several unusual solutions for extreme heat dissipation to Computex 2026. The company, led by overclocker der8auer, focused not only on familiar fans and thermal interfaces but also on experimental industrial engineering technologies.
The main development is the Mycro Direct-Die Diamond technology — a version of direct-die cooling where a thin diamond film is formed inside the water block via CVD (chemical vapor deposition). Diamond has significantly higher thermal conductivity than copper, so this layer should improve heat transfer from the processor die to the cold plate. On top of the diamond layer, a thin metal coating is applied to improve interaction with liquid metal and thermal contact between diamond and copper.
However, the Mycro Direct-Die Diamond likely won't reach the mass market. Thermal Grizzly sees the project primarily as a technology exploration: CVD diamond is too expensive for a regular product line. But the idea shows where extreme cooling could go if cost is no longer the main constraint.
A more realistic direction is the new TG X and TG C coatings, developed in collaboration with PLATIT, a manufacturer of PVD and PECVD deposition equipment. TG X uses deposited nickel, and TG C uses a carbon coating. The thin protective layer is meant to improve surface properties, enhance chemical and physical stability of materials, and potentially replace traditional nickel plating in mass production. Unlike CVD diamond, the PVD approach looks much closer to commercial application.
Thermal Grizzly also showed a more familiar product: the DeltaMate Fan P Series with high static pressure. They feature a rigid aluminum frame, a solid PCB design, dual D-RGB rings, built-in rubber elements for noise reduction, and daisy-chain capability via a proprietary USB interface. In the shadow of the diamond water block, these fans look far less exotic, but they are likely the ones with a better chance of reaching enthusiasts as a finished product.