The world’s largest contract chipmaker TSMC reportedly plans to raise manufacturing prices by 5–10% from the start of 2027. According to Nikkei Asia, the new terms could affect both mature nodes and advanced processes at 7 nm and below, including those used for Apple’s A-series and M-series processors.
Sources say talks with customers began in June and concluded in July 2026. The final increase may depend on the client and product type. Companies requiring more high-performance chips than originally forecast could also face an additional 10–15% premium.
The main reasons cited are higher material and production-equipment costs, along with spending on TSMC plants outside Taiwan. The company is expanding overseas capacity, including in the United States, as demand grows for advanced processors used in AI systems.
Apple is considered TSMC’s largest customer, so higher wafer prices could increase the production cost of future iPhone, iPad and Mac models. The change may coincide with anniversary iPhones expected in 2027, although it remains unclear whether Apple would absorb the extra expense or pass it on to buyers.
Apple CEO Tim Cook previously said price increases for some devices were becoming unavoidable because of sharply higher DRAM and flash-memory costs. TSMC has not officially confirmed the figures, saying only that its pricing policy is strategic rather than situational.