Leaked specs: MediaTek Dimensity 8500 on TSMC 4 nm with all-big ARM A725 cores, Mali-G720 GPU and ~2.2M AnTuTu, powering midrange phones from Redmi and OPPO.
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Well-known leaker Digital Chat Station has shared details about the MediaTek Dimensity 8500, the follow-up to last year’s Dimensity 8400 and a chip aimed at performance-focused mid-range smartphones.
According to the source, the Dimensity 8500 is built on TSMC’s 4 nm process and uses an eight-core ARM A725 setup where all the cores are “big.” The prime core is clocked at 3.4 GHz, slightly higher than the Dimensity 8400’s 3.25 GHz, with the remaining cores also running at elevated frequencies. The all-big-core approach hints at a design that favors sustained speed.
Graphics are handled by a Mali-G720 GPU running at roughly 1.5 GHz. Early figures point to around 2.2 million points in AnTuTu, and the insider claims the GPU’s theoretical performance could outpace the Snapdragon 8 Gen 3 and 8s Gen 4. Real-world results, however, will depend on software optimization, thermal control, and power efficiency—factors that often decide whether benchmark gains translate into everyday use.
The first wave of Dimensity 8500 phones is already in testing. One model targets the mainstream mid-range with a focus on performance, while another leans on a larger battery. Rumor has it the debut could happen within the Redmi Turbo line, with subsequent launches from Honor, OPPO, OnePlus, and vivo. If that roadmap holds, the chip could spread quickly across the upper mid-tier.
There’s no official announcement date yet, but the leak suggests MediaTek is lining up a forceful response to Qualcomm in the sub-flagship class—at least on paper.