Samsung ships 24Gb GDDR7 engineering samples at 32 and 36 Gbps: 3GB per chip in 266 FBGA, enabling 24–96GB GPU configs and multi-sourcing with SK hynix, Micron.
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Samsung quietly began shipping samples of its new, faster GDDR7 memory modules with a 24Gb density. The company had already moved 28 Gbit/s parts into mass production; now the lineup adds 32 and 36 Gbit/s options, all in the same 266 FBGA package. Both newcomers are labeled as engineering samples.
Each GDDR7 chip offers 3GB of capacity, a step up in density from the widely used 2GB parts found in most early Blackwell-based graphics cards. That 3GB-per-chip format fits neatly into workstation builds and top-tier gaming GPUs. For example, a 512-bit board can be populated with up to 96GB using 32 devices, while a 256-bit design reaches 24GB with eight chips. Those figures mirror configurations seen in the RTX PRO 6000 class or in mobile RTX 5090 models, with the same number of packages—only the density and speed change.
There is no official confirmation that the RTX PRO 6000 actually relies on Samsung’s 24Gb modules; reviews do not name the memory supplier. What is clear is that the card’s BIOS lists IDs for GDDR7 from Samsung, SK hynix, and Micron, allowing NVIDIA and its partners to switch suppliers based on price and availability.