Xiaomi's XRing O2 chip uses TSMC's 3nm N3P process, debuting in H1 with wider use in smartphones, tablets, cars, and PCs. Learn about performance gains.
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Xiaomi is preparing to launch its next flagship processor, the XRing O2, but a new report reveals that the chip won't use the most advanced 2nm manufacturing process. According to Chinese outlet Cailian Press, the new processor will be produced on TSMC's 3nm N3P technology, the same process used for the Snapdragon 8 Elite Gen 5 and Apple A19 Pro.
For Xiaomi, this still marks a step forward. The previous XRing O1 was built on the N3E process, and the shift to N3P promises gains in energy efficiency and performance. However, some enthusiasts may be disappointed, as competitors like Samsung are developing the Exynos 2600 on a 2nm process. In practice, development timelines make using TSMC's 2nm technology for the XRing O2 nearly impossible at this stage.
The XRing O2 is expected to debut in the first half of the year and become far more widespread than its predecessor. While the XRing O1 was used in only a few devices, the new chip is planned for significantly broader application—not just in smartphones and tablets, but also in cars and even PCs within Xiaomi's ecosystem.
Overall, this move highlights Xiaomi's strategy to reduce reliance on third-party chipmakers and expand its own presence across different tech segments.