Samsung forecasts strong memory chip demand through 2027, driven by AI. The company is mass-producing HBM4, improving hybrid bonding, and developing PIM technology to boost performance.
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Samsung anticipates that demand for its memory chips will remain strong through 2026 and 2027. Speaking at Semicon Korea, Song Jae-hyuk, the technical director of Samsung Device Solutions, outlined the company's current achievements and future plans. This sustained interest is driven by the AI boom, with major cloud platforms requiring ever more memory for computational tasks. As a result, chip prices are climbing.
The company is focused on mass-producing HBM4, a high-bandwidth memory format. Sales of the previous HBM3E generation saw significant growth in 2025, and Samsung plans to launch HBM4 this year. Early corporate clients have already reported very satisfactory performance from the new memory.
Samsung is also advancing hybrid bonding technology for HBM, which cuts thermal resistance in 12H and 16H stacks by 20%. This reduces the base chip temperature by 11%. Another innovation is zHBM, where chips are stacked along the Z-axis. This quadruples bandwidth while lowering power consumption by 25%.
Additionally, Samsung is developing HBM with integrated processing-in-memory (PIM) capabilities. This technology can boost performance by 2.8 times without sacrificing energy efficiency. All these efforts underscore Samsung's commitment to maintaining its leadership in the high-performance memory market.