AMD Medusa Point leak: Zen 6 on 3 nm with FP10 socket and RDNA 3.5+
Leaked specs reveal AMD Medusa Point: Zen 6 on TSMC 3 nm with new FP10 socket, 45 W TDP, up to 22 hybrid cores and RDNA 3.5+ graphics, targeting a 2026 launch.
Leaked specs reveal AMD Medusa Point: Zen 6 on TSMC 3 nm with new FP10 socket, 45 W TDP, up to 22 hybrid cores and RDNA 3.5+ graphics, targeting a 2026 launch.
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AMD is lining up its next-generation processors codenamed Medusa Point, with new leaks offering the first concrete technical clues. Entries in the NBD database indicate the chips will move to a fresh FP10 socket, replacing the FP8 used by the Strix Point series. For bring-up and debugging, AMD is already using a motherboard known internally as PLUM.
Medusa Point’s TDP is pegged at 45 W, a clear step up from Strix Point’s 28 W base (even though that platform could scale to 54 W). That kind of headroom points to a tangible performance uplift while keeping notebook power ranges flexible.
Insiders report that Medusa Point is based on the Zen 6 architecture and manufactured on TSMC’s 3 nm process. The family is expected to reach up to 22 cores through a hybrid arrangement that mixes Zen 6, Zen 6c, and low‑power LP Zen 6 cores. Graphics duties fall to an integrated RDNA 3.5+ design, still with up to eight compute units but tuned for better optimization versus RDNA 3.5.
An official launch is penciled in for late 2026. Early test work already underlines that AMD is steadily moving toward its next big step in mobile processors.