TSMC speeds its Angstrom-era roadmap, launching 2 nm in Arizona and Taiwan, ramping A16, and targeting A14 (1.4 nm) by 2028—setting a showdown with Intel’s 14A.
© D. Novikov
TSMC is closing in on the Angstrom era, the next wave of ultrafine process nodes. A fresh Ctee report says the company has accelerated its timeline to bring 2 nm and 1.4 nm production online in both the United States and Taiwan, a pace that leaves little doubt about its ambitions.
In Kaohsiung, southern Taiwan, six fabs are under construction. Five are slated to produce chips on 2 nm and A16 (1.6 nm) nodes, while a sixth is reserved for the future high-performance A14 (1.4 nm) node, expected to launch by 2028. Investment has already surpassed 1.5 trillion New Taiwan dollars—about 50 billion USD—placing the project among the largest in the company’s history and signaling a long-term bet on leading-edge manufacturing.
Meanwhile in Arizona, TSMC is preparing to start 2 nm production as early as next year—one year ahead of its initial schedule. The site is also set to adopt A16 technology and add a third and fourth fab, broadening the footprint of advanced manufacturing on U.S. soil.
The company is contending with a range of engineering hurdles—from plumbing and electrical fit-outs to staffing—but support from the U.S. government is helping it maintain speed. The momentum suggests a clear determination to hit milestones despite the complexity of standing up new facilities.
According to the report, TSMC’s A14 and Intel’s 14A are expected to arrive at roughly the same time in 2028, setting the stage for direct competition in the Angstrom era.